Israel Aerospace Industries Ltd. (IAI) has announced a cooperation agreement with two Indian companies – Dynamatic Technologies Ltd (DTL) and Elcom Systems Private Limited – to jointly address the needs of the Indian UAV market. 

The announcement followed the signing by the companies of a teaming agreement regarding the production, assembly and support of UAVs in India, during the visit of India's Prime Minister Modi to Israel. 

The cooperation agreement supports the existing infrastructure in India for current MRO (Maintenance Repair and Overhaul) programmes, while advancing the Indian government's "Make in India" initiative as well. The agreement involves the transfer of state of the art UAV technology and production capabilities from IAI to DTL and Elcom, in order to enable indigenous capability for UAV systems. 

Dynamatic and IAI have already partnered earlier this year for the manufacture of Mini UAVs under the Indian government's 'Make in India' initiative. 

Dynamatic Technologies designs and builds high-precision systems and sub-systems for Aerospace, Automotive, Hydraulics, and Homeland Security & Defense. Elcom is engaged in indigenous product development, technology platforms, manufacturing, testing and services in the field of electronics and communications for global and Indian clients including the Indian Ministry of Defense.

In a separate development, IAI and Wipro Enterprises (P) Limited have entered an agreement to collaborate in manufacturing of composite aerostructures in India, including establishing a facility for this purpose. The agreement was signed during India Prime Minister's visit in Israel. 

The agreement stipulates that IAI will transfer technology and assist Wipro in building a plant for manufacturing and assembly of aero structures for the civilian aerospace sector. The agreement forms the foundation for broader future collaboration between the two companies in India and is expected to support IAI's leadership in this arena while supporting the implementation of future projects.